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A Cellular Automata Simulation Program for Silicon Anisotropic Super Micro-etching Process in Aqueous KOH
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| Organization: | Iwate University |
| Department: | Department of Electrical and Electronic Engineering |
| Organization: | Iwate University |
| Department: | Department of Electrical and Electronic Engineering |
| Organization: | University of Illinois at Urbana-Champaign |
| Department: | Department of Material Science and Engineering |
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0210-867
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1999-11-29
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A three-dimensional anisotropic super micro-etching of crystalline silicon in aqueous KOH is simulated on an atomic level using a new three-dimensional cellular-automata calculational method. The etching simulator ASECA is developed using a rule-based functional Mathematica programming style.
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cellular automata, etching, simulation, silicon
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| ASECA.nb (1.4 MB) - Mathematica package |
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