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ASECA: A Cellular-Automata Simulation Program for a Silicon Anisotropic Super-Micro-Etching Process in Aqueous KOH
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| Organization: | Iwate University |
| Department: | Department of Electrical and Electronic Engineering |
| Organization: | University of Nebraska-Lincoln |
| Organization: | University of Illinois at Urbana-Champaign |
| Department: | Department of Material Science and Engineering |
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A three-dimensional anisotropic super micro-etching of crystalline silicone in aqueous KOH is simulated on an atomic level using a new three-dimensional cellular-automata calculational method. The etching simulator ASECA is developed using a rule-based functional Mathematica programming style. The complete program codes and a detailed description of the algorithm are presented.
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