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A Cellular Automata Simulation Program for Silicon Anisotropic Super Micro-etching Process in Aqueous KOH
Authors

Kazume Nishidate
Organization: Iwate University
Department: Department of Electrical and Electronic Engineering
Mamoru Baba
Organization: Iwate University
Department: Department of Electrical and Electronic Engineering
Richard J. Gaylord
Organization: University of Illinois at Urbana-Champaign
Department: Department of Material Science and Engineering
Old MathSource #

0210-867
Revision date

1999-11-29
Description

A three-dimensional anisotropic super micro-etching of crystalline silicon in aqueous KOH is simulated on an atomic level using a new three-dimensional cellular-automata calculational method. The etching simulator ASECA is developed using a rule-based functional Mathematica programming style.
Subjects

*Mathematica Technology > Programming > 2D Graphics
*Mathematica Technology > Programming > 3D Graphics
*Mathematics > Discrete Mathematics > Cellular Automata
*Science > Chemistry
Keywords

cellular automata, etching, simulation, silicon
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ASECA.nb (1.4 MB) - Mathematica package